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Using Lasers as Safe Alternatives for Adhesive Bonding: Emerging Research and Opportunities

Ciecińska, Barbara Ewa
150.00 USD
Member Price
135.00
English

Product Description

Analyses the new conditions for laser processing in the context of adhesive bonding. The book includes the results of experimental research, giving grounds to believe that laser technology has a future in the preparation of products for bonding.

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