§15§Dieses Referenzwerk ist eine umfassende und systematische Einführung in die Technologien für das Packaging und die heterogene Integration von Mikrosystemen. Der Schwerpunkt liegt auf MEMS aus Silikon, die in großem Umfang zum Einsatz kommen, und auf Technologien zur Systemintegration. Die Themenbereiche umfassen u. a. Bulk-Mikromechanik, Oberflächen-Mikromechanik, CMOS-MEMS, Wafer-Verbindungen, Waferbonden und Wafer-Sealing. §16§This book introduces technologies for microsystem packaging and heterogeneous integration comprehensively and systematically. It focuses on the silicon MEMS which have been used in large volume and the technologies concerning system integration. The topics include bulk micromachining, surface micromachining, CMOS-MEMS, wafer Interconnection, Wafer bonding and Sealing. §04§minum nitride MEMS7.2. Heterogeneous integration of aluminum nitride MEMS resonators with CMOS circuits7.3 Heterogeneously integrated self-healing filters8. MEMS USING CMOS WAFER8.1 Introduction : CMOS MEMS architectures and advantages8.2 Process modules for CMOS MEMS8.3 The 2P4M CMOS platform (0.35µm)8.4 The 1P6M CMOS platform (0.18µm)8.5 CMOS MEMS with add-on materials8.6 Monolithic integration of circuits and sensors8.7 Issues and Concerns8.8 Concluding remarks9. WAFER TRANSFER9.1 Introduction9.2 Film transfer9.3 Device transfer (Via-last)9.4 Device transfer (via-first)9.5 Chip level transfer10. PIEZOELECTRIC MEMS10.1 Introduction10.2 PZT thin film deposition10.3 PZT-MEMS fabrication processPART III BONDING, SEALING AND INTERCONNECTION11. ANODIC BONDING11.1 Principle11.2 Distortion11.3 Influence of anodic bonding to circuits11.4 Anodic bonding with various materials, structures and conditions12. DIRECT BONDING12.1 Wafer direct bonding12.2 Hydrophilic wafer bonding12.3 Surface a §02§Masayoshi Esashi is Professor in the Micro System Integration Center at Tohoku University, Japan. He obtained his PhD from Tohoku University and has been working there as a researcher and teacher. His research interests include MEMS, integrated sensors and MEMS packaging. He has published more than 500 scientific papers and has received numerous awards including the IEEE Andrew S. Grove Award in 2015 and IEEE Jun-ichi Nishizawa medal in 2016. §04§nodic bonding18.3 Packaging by anodic bonding with controlled cavity pressure18.4 Vacuum packaging by metal bonding18.5 Vacuum packaging by deposition18.6 Hermeticity testing19. BURIED CHANNELS IN MONOLITHIC SI19.1 Buried channel/cavity in LSI and MEMS19.2 Monolithic SON technology and related technologies19.3 Applications of SON20. THROUGH-SUBSTRATE-VIAS20.1 Configuration of TSVs20.2 TSV applications in MEMS20.3 Considerations for TSV in MEMS20.4 Fundamental TSV fabrication technologies20.5 Polysilicon TSVs20.6 Silicon TSVs20.7 Metal TSVs
